LENZE Low power and low-cost Bluetooth SOC chip - SRAM_SRAM chip_MRAM_PSRAM_everspin_netsol_JSC_Ramsun Micro-electronincs

LENZE

LENZE Technology is a technology company dedicated to the development of Bluetooth BLE and IoT chips, and a high-tech enterprise integrating R&D, design, solutions, testing, pre certification and technical support. It mainly provides highly integrated, cost-effective and low-power Bluetooth SOC chips. The main chips and solutions include Apple Find My, Alexa Direct Connect, Mijia, Hongmeng, Industry 4.0 and consumer electronics.

Number	Package	Version	CPU Core	Temperature	Voltage	Transmitting power	Frequency	Fash	OTP	Function	PDF Download
ST17H26	TSSOP16	4.2	RISC	-40~85℃	1.8~3.6V	+6dB	32MHz	NO	NO	Support 2Mbps peak transmission rate	Not Find
ST17H25	QFN32	4.2	RISC	-40~85℃	1.8~3.6V	+6dB	16/32/48MHz	512KB	16KB	Support 2Mbps peak transmission rate	Not Find
ST17H62	QFN32	5.2	Cortex-M0	-40~125℃	1.8~3.6V	+10dB	16/48/64MHz	512KB	NO	Support 2Mbps peak transmission rate and 200Byte long packet data	Not Find
ST17H63	QFN48	5.2	Cortex-M0	-40~125℃	1.8~3.6V	+10dB	16/48/64MHz	512B	NO	Support 2Mbps peak transmission rate and 200Byte long packet data	Not Find
ST17H65	QFN32	5.2	Cortex-M0	-40~85℃	1.8~3.6V	+10dB	16/48/64MHz	512KB	NO	Support 2Mbps peak transmission rate and 200Byte long packet data	Not Find
ST17H66B	TSSOP16	5.2	Cortex-M0	-40~85℃	1.8~3.6V	+10dB	16/48/64MHz	256KB	NO	Support 2Mbps peak transmission rate and 200Byte long packet data	Not Find
ST17H66T	TSSOP16	5.2	Cortex-M0	-40~85℃	1.8~3.6V	+10dB	16/48/64MHz	NO	16KB	Support 2Mbps peak transmission rate and 200Byte long packet data	Not Find

BLE 5.0